-18%




0333 0429795 | 0312 5479795 | 051 2802134-37
Premium zinc oxide-based thermal compound for optimal thermal performance to improve heat transfer and lower temperatures.
Ultra-low thermal impedance lowers CPU temperatures vs common thermal paste.
XTM50’s low-viscosity allows it to easily fill microscopic abrasions and channels for peak thermal transfer.
An included application stencil and spreader take the guesswork out of applying XTM50 to your CPU cooler.
Hurry and get discounts on all Apple devices up to 20%
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₨4,000.00 Original price was: ₨4,000.00.₨3,300.00Current price is: ₨3,300.00.
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Premium zinc oxide-based thermal compound for optimal thermal performance to improve heat transfer and lower temperatures.
Ultra-low thermal impedance lowers CPU temperatures vs common thermal paste.
XTM50’s low-viscosity allows it to easily fill microscopic abrasions and channels for peak thermal transfer.
An included application stencil and spreader take the guesswork out of applying XTM50 to your CPU cooler.
The ASUS PRIME H610M-K D4 is a micro-ATX motherboard designed for Intel® LGA 1700 processors. Let’s delve into its features:
Socket Compatibility: The motherboard supports 13th and 12th Gen Intel® Core™ processors with the LGA1700 socket.
Memory and Expansion Slots:
Connectivity and Ports:
Cooling and Durability:
Audio Quality:
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