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Warranty 1 year
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Cooler Master’s new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components. Formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulated properties make it safe and simple for application without the worry of hardening or solidifying. The double-sided adhesive provides seamless contact between surfaces. The Thermal Pad can be cut to size perfect for any application, making it extremely convenient, simple and versatile.
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₨2,200.00
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Cooler Master’s new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components. Formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulated properties make it safe and simple for application without the worry of hardening or solidifying. The double-sided adhesive provides seamless contact between surfaces. The Thermal Pad can be cut to size perfect for any application, making it extremely convenient, simple and versatile.
The ASUS PRIME H610M-K D4 is a micro-ATX motherboard designed for Intel® LGA 1700 processors. Let’s delve into its features:
Socket Compatibility: The motherboard supports 13th and 12th Gen Intel® Core™ processors with the LGA1700 socket.
Memory and Expansion Slots:
Connectivity and Ports:
Cooling and Durability:
Audio Quality:
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