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Warranty 1 year
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CM Thermal Pad 1.0mm
Overview
Cooler Master’s new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components. Formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulated properties make it safe and simple for application without the worry of hardening or solidifying. The double-sided adhesive provides seamless contact between surfaces. The Thermal Pad can be cut to size perfect for any application, making it extremely convenient, simple and versatile.
- Formulated with Nano Elements: Nano zinc oxide and nano alumina particles deliver a thermal conductivity of 13.3 w/mK for rapid cooling, suitable for a wide range of electronics and devices.
- Non-toxic and Non-corrosive: Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening
- Double-sided Adhesive: Provides seamless and secure contact between surfaces
- Versatile and Easy Application: Easily cut to the perfect size for your application
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Overview
Cooler Master’s new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components. Formulated with nano zinc oxide and nano alumina, it boasts a thermal conductivity of 13.3w/mK for rapid cooling. The non-toxic, non-corrosive, and electrically insulated properties make it safe and simple for application without the worry of hardening or solidifying. The double-sided adhesive provides seamless contact between surfaces. The Thermal Pad can be cut to size perfect for any application, making it extremely convenient, simple and versatile.
- Formulated with Nano Elements: Nano zinc oxide and nano alumina particles deliver a thermal conductivity of 13.3 w/mK for rapid cooling, suitable for a wide range of electronics and devices.
- Non-toxic and Non-corrosive: Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening
- Double-sided Adhesive: Provides seamless and secure contact between surfaces
- Versatile and Easy Application: Easily cut to the perfect size for your application
Overview
The ASUS PRIME H610M-K D4 is a micro-ATX motherboard designed for Intel® LGA 1700 processors. Let’s delve into its features:
Socket Compatibility: The motherboard supports 13th and 12th Gen Intel® Core™ processors with the LGA1700 socket.
Memory and Expansion Slots:
- Dual Channel DDR4: It accommodates up to 32GB of DDR4 RAM running at 3200MHz.
- PCIe Slots: Includes 1 x PCIe 4.0 x16 SafeSlot Core and 1 x PCIe 3.0 x1 for expansion cards.
- M.2 Slot: Features a 32Gbps M.2 slot for high-speed storage.
Connectivity and Ports:
- USB Ports: Equipped with USB 3.2 Gen 1 ports for fast data transfer.
- Ethernet: Utilizes Realtek 1 Gb Ethernet for reliable network connectivity.
- Video Outputs: Offers both HDMI® and D-Sub ports.
- SATA Ports: Supports up to 4 x SATA 6Gb/s devices.
- COM Header: Includes a COM header for legacy serial communication.
- RGB Header: Allows customization with RGB lighting.
Cooling and Durability:
- Comprehensive Cooling: Features hybrid fan headers configurable via Fan Xpert software or the UEFI BIOS.
- 5X PROTECTION III: Provides multiple hardware safeguards for all-round protection.
- Military-Grade Components: Ensures durability and stability.
- Digi+ VRM: Enhances power delivery for optimal performance.
Audio Quality:
- Onboard Audio: Combined features deliver elevated audio quality.
- Intelligent Design: Premium hardware ensures exceptional sound.
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